Vacancy

Senior Engineer, Firmware (BSP)
As a member of our new product development team, the incumbent in this position is responsible for the development (coding/debugging/testing) of BSP related feature in Rolling Wireless Auto module development.
Position / Assignment Purpose
Development of BSP related features (I2C/UART/GPIO/MIPI/USB/SPI/SDIO/I2S/PCM/Ethernet/Reliability feature…) for Rolling Wireless Auto modules.
Key Accountabilities / Statement of Work
  • Deliver High quality design for BSP related features – deliver High LevelDesign(HLD) / Software Detailed Design(SDD)
  • Follow Rolling Wireless coding standards and deliver high quality C code
  • Apply common debugging tools (GDB/KDB/QXDM/QPST…) to debug the issues in BSP feature development
  • Design comprehensive unitary test cases for BSP related features and ensure the features pass the unitary test cases - Involve in design review activities and contribute high quality comments in the expertise areas
  • Involve in code review activities and contribute high quality comments in the expertise areas
  • Troubleshooting in some critical technical issues
  • Prototyping of new technology and product ideas
Required Education
BSEE/CS is mandatory, MS is preferable
Required Experience
  • At least 5 years’ work experience in embedded software development
  • At least 3 years’ work experience in embedded Linux device driver development
  • Good skills in C programming Language - Familiarity with ARM architecture and ARM assembler
  • Familiarity with theory of Real-time operation system, strong working knowledge of multi-thread programming
  • Hands on experience in embedded Linux software development/debugging method
  • Hands on experience in embedded software development/debugging method and tools
  • A creative, quick-learner with excellent verbal and written communication skills. Fluent verbal and written English is an essential
  • Proactive working attitude. Being able to work well both independently and in a group
Required Skills and Competencies
  • Desired skills: 
  • Experience in Linux USB/PCIE Driver
  • Experience in Qualcomm platform
  • Familiarity with general software engineering, e.g., configuration management, documentation, build management
  • Familiarity with design patterns
  • Familiarity with UML
Location
Shenzhen
Employment type
Full-time
Apply now →

See more open positions and apply

Open position Location
Senior Manufacturing Test Engineer Shenzhen →
Certification Engineer Shenzhen →
Sourcing Manager Shenzhen →
Commodity Manager Shenzhen →
Senior Buyer Shenzhen →
Corporate Quality Expert on ISO26262 and ISO21434 Shenzhen →
Technical Business Developer, France Paris →
Technical Business Developer, Germany Munich →
Technical Acceptance Manager (AT&T, T- Mobile, Verizon) Remote in the US (WA/NJ/TX) →
Staff Software Support Engineer Munich or Paris →
Software Project Manager Munich →
Director, Software Development Shenzhen →
Key Account Manager Korea Korea →
Certification Support Engineer USA (optional: CA/TX/WA/NJ) →
Senior Engineer, Firmware (BSP) Shenzhen →
Senior Engineer, Firmware - Protocol Shenzhen →
Firmware Engineer - Protocol Shenzhen →
Senior Engineer, Embedded Linux Software Shenzhen →
Firmware Engineer (BSP) Shenzhen →

Can’t find an offer matching your profile?

Send us an unsolicited application!

Submit resume →